About LED chip manufacturing process
Datum:2011-05-31 18:04
Staat:ungeloest
Frage:admin
ted steps to complete the final number of layers in the wafer processing and production of circuits and components.
2, the wafer probing process
After the procedure, the wafer to form a one of a small cell, that is, grain, under normal circumstances, for ease of testing, improving efficiency, making the same wafer with a variety of product specifications; but it can need to make several different varieties and specifications. In the needle test (Probe) instrument for testing the electrical chara
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