About LED chip manufacturing process
Datum:2011-05-31 18:04
Staat:ungeloest
Frage:admin
cteristics of each grain and the grain marked failure mark, cut the wafer, divided into those many separate grains, then the electrical characteristics classified into different pallets, the grain is unqualified discarded.
3, the packaging process
The grain is fixed in a single plastic or ceramic chip base and etched into some of the grain terminal and the base lead out the bottom of the pin connections with the outside world as is used for connecting the circuit board, Finally covered with plas
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