About LED chip manufacturing process
Datum:2011-05-31 18:04
Staat:ungeloest
Frage:admin
tic lid, sealed with glue. Its purpose is to protect the grain to avoid scratching or heat damage by machinery. Regarded as made of a piece of this integrated circuit chip (that is, we can see in the computer those black or brown, on both sides or four sides with many small pins or leads of the rectangle.)
4, the test procedure
The final steps of making the test, the test can be divided into general and special test, the former chip is placed after the package under a variety of environments to
Beste Antwort:
noch nicht vorhanden
[Alle Antworten(0)]
[Ich habe zu beantworten]
4/12 Weiter Zurueck Home Letzte
Rückkehr
auffrischen
WAP Home
Web-Version
Login
06/25 07:50